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机械剥离专用蓝膜(多种型号)

简要描述:PN

DESCRIPTION

ADHESION (1)

ADHESION (2)

1003R

Blue Adhesive Plastic Film (PVC), Silicone Release Agent-Free, High Adhesive Strength, 139 microns thick (5 mils),supplied in 100 meter (330') rolls

  • 更新时间:2022-07-29
  • 产品型号:
  • 厂商性质:生产厂家
  • 访  问  量:135

详细介绍

PN

DESCRIPTION

ADHESION (1)

ADHESION (2)

1003R

Blue Adhesive Plastic Film (PVC), Silicone Release Agent-Free, High Adhesive Strength, 139 microns thick (5 mils),supplied in 100 meter (330') rolls without backing (typical use- wafer and ceramic dicing)

350/520

370/550

1004R

Blue Adhesive Plastic Film (PVC), Silicone Release Agent-Free, Medium-High Adhesive Strength, 130 microns thick (5mils), supplied in 100 meter (330') rolls without backing(typical use - wafer and ceramic dicing)

160/270

170/250

1005R

Blue Adhesive Plastic Film (PVC), Silicone Release Agent-Free, Medium-High Adhesive Strength, 125 microns thick (5mils), supplied in 100 meter (330') rolls without backing(typical use - wafer and ceramic dicing)

90/170

100/150

1007R

Blue Adhesive Plastic Film (PVC), Silicone Release Agent-Free, Medium Adhesive Strength, 80 microns thick (3 mils),supplied in 100 meter (330') rolls without backing (typical use- wafer dicing)

70/135

76/130

1008R

Blue Adhesive Plastic Film (PVC), Silicone Release Agent-Free, Medium-High Adhesive Strength, 80 microns thick (3mils), supplied in 100 meter (330') rolls without backing(typical use - wafer dicing)

95/170

100/160

1009R

Blue Adhesive Plastic Film (PVC), Silicone Release Agent-Free, Low Adhesive Strength, 80 microns thick (3 mils),supplied in 100 meter (330') rolls without backing (typical use- wafer dicing)

30/50


1035R

Blue Adhesive Plastic Film (PVC), Silicone Release Agent-Free, Medium-High Adhesive Strength, 145 microns thick (5mils), supplied in 100 meter (330') rolls without backing(typical use - wafer dicing)

70/73


(1) adhesion is measured at 30 minutes and 24hours after application to Stainless Steel, using grams per 25 mm width
(2) adhesion is measured at 30 minutes and 24hours after application to Silicon Wafer, using grams per 25 mm width


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